Meaningful SPI Production Control Through Automatic Normalization

Automated pre-placement solder paste inspection (SPI) has established itself in SMT assembly as an essential tool for optimizing the process and reducing end of line defects.  It’s been commonly accepted for many years that a majority of assembly defects can be traced back to print defects, and by using raw measurement data from printed PCBs for volume, area, height and offset, SPC histograms and control charts can quite readily be used to optimize the process. Continue reading

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