We are busy preparing for the forthcoming Productronica show in Munich where we’ll be launching a whole host of new AOI & SPI systems across a very wide range of applications and budgets. The Mek team will be on hand at Hall A2 stand 402 to host demonstrations of unique capability. Continue reading
3D measurement is the latest development trend in assembled PCB inspection. It’s creating quite a stir and it does indeed offer many advantages in terms of improved accuracy & stability of inspection results. Having quantitative data gives much tighter control than “classic” AOI and is a big step forward in improving the quality assurance and process control of assembled PCBs.
Unfortunately, the term ‘Full 3D’ is often used inaccurately. Full 3D implies that the height profile across the whole PCB is being measured, but most of the time, the majority of systems can only measure height selectively, and only on component bodies, NOT the solder joints. And even then, only the components that the programmer has specifically identified and selected for height measurement. For the remainder, classic 2D algorithms and lights are used for the inspection. Continue reading