Simultaneous bottom and top inline inspection

PowerSpector BTL - Bottom & top inline AOI

PowerSpector BTL Bottom & Top In Line Automatic Optical Inspection Systems

PowerSpector BTL - bottom -top inline AOIThe fastest inspection of PCBs after Reflow, Wave or Selective soldering & placement of SMT & THT components.

  • Patented lighting synchronization allows both heads to inspect at the same time.
  • Eradicate the need for flip stations – remove potential for stress on assemblies and improve long term reliability of solder joints.
  • Reliably detect solder and components related defects from both sides using up to 18 cameras.

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What are the major challenges today in inspection in the electronics manufacturing industry?

Mek THT AOIThe major challenge for AOI in today’s industry is one of protocol, improved track and trace and data logging for all the products coming in/ going out, including products which to date have rarely been inspected, like those still using THT components.

Pressure for increased inspection and traceability information comes from OEMs, wanting to protect their brand. AOI of course helps to reduce faults creeping through on the production line and traceability helps to facilitate product recalls should any issues arise. Continue reading

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6 sigma 3D inspection at Productronica and Apex

Mek at ProductronicaThe team from Marantz Electronics (Mek) enjoyed a very successful Productronica exhibition in Munich, Germany this year.
44,000 visitors from 85 countries came to Munich, an increase of almost 20% over the previous event and the Marantz stand was overwhelmed by the positive feedback from visitors and distributors, all impressed by the company’s new AOI technologies.
Productronica represented the European launch of Mek’s new flagship 3D AOI system ISO-Spector M1A, which will subsequently be rolled out across the rest of the world in 2018. Continue reading

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Meaningful SPI Production Control Through Automatic Normalization

Automated pre-placement solder paste inspection (SPI) has established itself in SMT assembly as an essential tool for optimizing the process and reducing end of line defects.  It’s been commonly accepted for many years that a majority of assembly defects can be traced back to print defects, and by using raw measurement data from printed PCBs for volume, area, height and offset, SPC histograms and control charts can quite readily be used to optimize the process. Continue reading

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