New AOI & SPI launches at Productronica

ISO-Spector M1 3D AOIWe are busy preparing for the forthcoming Productronica show in Munich where we’ll be launching a whole host of new AOI & SPI systems across a very wide range of applications and budgets. The Mek team will be on hand at Hall A2 stand 402 to host demonstrations of unique capability.

Mek ISO-Spector M1, featuring the latest in 3D inspection technology, will be our flagship launch at the show. A metrological AOI system of true measurement, the M1 delivers full, across-the-board height profile measurement and inspection. Carrying the industry’s largest, 25 mega pixel sensor and 69 x 69mm FoV the M1 delivers ultra-high speed inspection of even 008004 components, leads and solder joints. Multiple Moiré fringe projections enable high precision, shadow free measurement of heights up to 30mm as well as 4 fully programmable side view high-res cameras able to actively inspect Jleads and other devices invisible to top side imagers.

Other product highlights at the show include:

SpectorBOX GTAz 550
“Bottom Up/Top Down” AOI system

iSpector JDz 520
New entry level AOI boasting high specifications, including a 5 mega pixel camera, 15 micron telecentric lens, Co-Axial light and 520 x 460mm max. PCB size

ISO-Spector S2
New SPI system with patented third generation sensor technology that enables simultaneous 3D and 2D (5D) 2D and 3D inspection

PowerSpector GTAz+GDAz 550LBT
Double sided AOI with in total 18 camera’s

Find out more.

For more information about these or any other Mek solutions contact info@mek-europe.com

We forward to welcoming visitors to our booth at Productronica, 14th – 17th November

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Meaningful SPI Production Control Through Automatic Normalization

Automated pre-placement solder paste inspection (SPI) has established itself in SMT assembly as an essential tool for optimizing the process and reducing end of line defects.  It’s been commonly accepted for many years that a majority of assembly defects can be traced back to print defects, and by using raw measurement data from printed PCBs for volume, area, height and offset, SPC histograms and control charts can quite readily be used to optimize the process. Continue reading

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