Meaningful SPI Production Control Through Automatic Normalization

Automated pre-placement solder paste inspection (SPI) has established itself in SMT assembly as an essential tool for optimizing the process and reducing end of line defects.  It’s been commonly accepted for many years that a majority of assembly defects can be traced back to print defects, and by using raw measurement data from printed PCBs for volume, area, height and offset, SPC histograms and control charts can quite readily be used to optimize the process. Continue reading

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Facing the Challenges of THT Inspection

SpectorBOX - bottom up AOI inspectionThe deployment of AOI technology for THT inspection has historically been restricted by a number of factors. These include the physical configuration of most wave and selective soldering lines, which do not lend themselves to conventionally designed AOI machines that are now popular in SMT flow lines. Product is processed in pallets moving on a continuous drive with automatic return on which the inspection must take place.
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