Top-Down? Bottom-Up? Mek SpectorBOX AOI covers it all!

Recent new additions to our ground breaking SpectorBOX AOI system include a massive 5 inch camera clearance that enables complete single pass inspection of virtually any assembly.

Mek SpectorBOX Bottom-Up / Top-Down AOI systemThe Mek SpectorBOX modular AOI systems have long been optimized for the inspection of THT components to identify defects such as presence/absence, wrong polarity, color, type, and bent pins.  And now, the unique top clearance of 130mm (5.12”) allows the Top-Down SpectorBOX to inspect virtually any completed electronic and  – even when the tallest of components are present.

The SpectorBOX modules can be equipped with 8 wide field of view side cameras in addition to top view camera on the FWAz optical unit.  Its large pixel (18,8μ2) capturing sensor delivers smooth and detailed images with great dynamic range.

Its Z-Axis adjustable optical head can adapt to any PCB thickness, and automatically compensates for warpage. The highly reliable text and polarity inspection on tall components enables the inspection of complex, completed assemblies without the need for fixtures or multiple inspections.

The addition of 8 simultaneously operating multiplexed angular side cameras which are  available for the FWAz model, facilitate active automatic inspection, classification and repair, as the system displays and also stores 9  brilliantly clear defect review angles in full color.

This new configuration effectively complements Mek’s THT Bottom-Up Modular AOI – a system that can be conveniently positioned at any conveyor location. Typically, bottom side PCB inspection requires flipping units combined with a standalone inline AOI. The slim design of the Bottom-Up SpectorBOX instead allows it to be positioned below existing return and/or feed conveyors, saving space and money.

A cost effective way to combine Bottom-Up and/or Top-Down inspections is provided by the Nutek Main Frame, a turnkey solution that enables simple integration of one or two SpectorBOX systems into a production line.  Built for flexibility, it can be configured to the output of any wave or selective soldering system. The ergonomic design is optimized for operators to have eye-height monitors as well as wrist height keyboard and mouse control. This makes operation easy in a standing or seated position, even when dual SpectorBOXes are in use via double monitor configuration. A manual mode allows for smooth offline programming preparation.

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PKC Group purchases Mek AOI

Mek ( Marantz Electronics Ltd), has installed an iSpector AOI system within PKC Group in Finland.  In association with Mek partner, SMT House, the manufacturer recently commissioned an iSpector HDL350 at its Raahe site in Finland.

PKC designs and manufactures electrical distribution systems, wire & cables, wiring components and electronics predominantly for the commercial vehicle, automotive and electronics industries. With 19,759 employees globally the Group’s net sales amounted to EUR 928.2 million in 2012. The Electronics division,  headquartered in Raahe, offers flexible prototype and customised low volume, high mix production services.
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Mek (Marantz Electronics) Launches Direct Operations in the Americas

Mek Americas officeThis is an exciting time for Mek. The beginning of this month marked the opening of our direct sales, marketing and applications engineering operations in the Americas.  Headquartered in Nevada, Mek Americas LLC will be directed by industry veteran John Rider.
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Mek turns AOI On Its Head with In-Line Bottom Side PCB Inspection

Mek Bottom-Up Modular AOI

Mek Bottom-Up Modular AOI

At last month’s Productronica exhibition we successfully launched the new SpectorBOX “Bottom-Up” Modular AOI system. The system replaces traditional board flipping alternatives in less space and at lower cost. 

 Optimized for the inspection of Wave & Selective soldering of THT & SMT components, SpectorBOX is designed to inspect PCB’s inside solder frames directly from the conveyor system.  With its totally new mechanical platform, it is the only modular AOI in the market that can be equipped with 9 cameras, including an optional Z-axis moveable head to precisely position and focus for varying PCB distance and warpage.  Continue reading

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Mek has moved!

Mek new offices in Tilburg

Mek Europe new offices – Tilburg

We have moved to accommodate our growing AOI and SPI business

Since the formal start of Mek Europe in 2011 (formerly Marantz) we have been sharing premises with Partnertec, our Dutch agent, in Oirschot near Eindhoven and have expanded our business significantly since then.

In order to serve our customers the very best we can, and to allow for the expansion of both companies, we are extremely proud to announce that Mek Europe headquarter’s has moved to a new office, located in Tilburg West Industrial Area as of 1st October 2013.

Tilburg is located 40kms west of Eindhoven and serves as a main logistics port for  parts of Europe south of the Netherlands and for the European headquarters of numerous multinational companies.

The new office accommodates demo, training and meeting facilities in addition to our daily operations.  We’d be delighted to welcome you and your customers to our new premises to discuss all aspects of our AOI and SPI business in a modern and relaxing, industrially designed, atmosphere.

Looking forward meeting you in Tilburg!

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MEK’s Latest 5D SPI System Features Patented New Sensor Technology

We recently launched our latest automated Solder Paste Inspection system.  The PowerSpector S1 mkII features patented second generation sensor technology that enables unique, simultaneous 2D and 3D inspection.

 The resultant high speed 5D technology measures beyond the bounds of apertures with 2D/3D comparative analysis that can determine slump and release defects.  The newly re-engineered inspection head has improved 2D image capture providing enhanced accuracy and repeatability surpassing all existing systems, especially important for the thinner stencils and smaller component pads of tomorrow.
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THT AOI Inspection

Through Hole Technology for assembling electronic circuits is often described as an old fashioned technology that is losing its popularity and becoming less applied and replaced by SMT, surface mount technology. No wonder, as electronic devices where SMT is used are more compact, thinner, lighter, faster and consume less energy. Besides, SMT is much more efficient from an assembly point of view and SMD, surface mount device components cost less. Basically the replacement of THT by SMT is nothing recent but has been on-going since  the introduction of SMT in the late 1980s but increased significantly in the last decade. Except for high-power circuitry where SMT is being combined with THT, we can say that MT is the current widely applied assembly technology. Typically, the main focus of most vendors is to invent and develop equipment that is specialized in packaging, placing, solder reflowing, reworking, inspection etc. of SMD parts. Only a small number of vendors are developing and offering THT equipment. This equipment is mainly focused on the soldering part of the assembly process.
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