Mek’s new GTAz AOI Range Provides the Perfect Combination of 3D and 2D Inspection

Mek GTAz range of selective 3D AOI systemsMek (Marantz Electronics), has announced the launch of GTAz, its newest and most advanced optical head available on the company’s PowerSpector and SpectorBOX range of AOI machines.

The GTAz delivers true Stereoscopic imaging using its 9 high speed (90 Fps) cameras operating in full 24 bit color. This new generation optical head removes the need for expensive capture cards utilising Thunderbolt2 20GBs transfer speeds and full frame transfer. 3D from 9 camera views gives the ability to actually see the side of components rather than extruded 2D images from single camera systems. The result is a perfect combination of the 3D features such as verification of body height, tilt and coplanarity along with the 2D fast programming advantages and pin height and solder meniscus profile analysis, component presence/absence, polarity, value, angle, offset, color, extra part detection, solder ball detection and short detection.

Unique stereoscopic 3D imaging is achieved utilizing the full 9 cameras of the GTAz. The image differentials are merged and a vectorised map of the component is created, then analysed based on the programmer’s applied tolerances. This unique Selective 3D methodology requires no active light projection, and thus is both less costly than other 3D solutions and compact enough to be deployed in desk top systems.

Line Sourced DOAL (Direct On Axis Lighting) coaxial lighting system with high resolution Telecentric Optics enables the inspection of solder joints without shadow effects from tall components nearby as well as accurate inspection model building. Omnidirectional multi angle, multi colour LED lighting provides optimal illumination regardless of component direction.

The modular bottom up/top down SpectorBOX GTAz is optimized for the inspection of THT solder joints and the detection of solder bridges and solder balls.

Find out more at www.marantz-electronics.com

 

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Simultaneous Top & Bottom PCB inspection addresses growing new needs in electronic assembly.

SpectorBOX - bottom up AOI inspectionInline Bottom side PCB Inspection with up to 9 cameras, configurable to simultaneous Top & Bottom PCB inspection with up to 18 cameras addresses growing new needs in electronic assembly. 

Emerging trends in printed circuit board assembly, in particular high power automotive electronics, present an increasing requirement for automated inspection of THT.  Rework is increasingly forbidden, pressurizing selective and wave soldering yields, and making AOI the solution of choice.

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Mek turns AOI On Its Head with In-Line Bottom Side PCB Inspection

Mek Bottom-Up Modular AOI

Mek Bottom-Up Modular AOI

At last month’s Productronica exhibition we successfully launched the new SpectorBOX “Bottom-Up” Modular AOI system. The system replaces traditional board flipping alternatives in less space and at lower cost. 

 Optimized for the inspection of Wave & Selective soldering of THT & SMT components, SpectorBOX is designed to inspect PCB’s inside solder frames directly from the conveyor system.  With its totally new mechanical platform, it is the only modular AOI in the market that can be equipped with 9 cameras, including an optional Z-axis moveable head to precisely position and focus for varying PCB distance and warpage.  Continue reading

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