Two New Leadership Appointments to Take Company through Next Phase of Growth

New Americas leadership team, Mek AmericasMek (Marantz Electronics), has recently appointed two new people to form our next generation of leadership in the Americas region.

Cleve Williams joins Mek as Product Manager and Rich Heimsch takes on a new consultancy role assisting in the ongoing development of sales strategy and tactics for the Americas. Both Rich and Cleve will assume their roles effective immediately.

Cleve brings more than 18 years of experience to Mek with specialist experience in SMT Process and Documentation, Automated Optical Inspection & Solder Paste Inspection, including specific experience of Mek technology. Based in Central Chicago area, Cleve will share his time with Mek while continuing to work as Sales Manager for the company’s Mid West representative organisation, Restronics. In this new split role he will have an ideal combination of technical and commercial responsibilities.

In his new role, Rich Heimsch will assist the Mek team with general Sales Management to steer business development and expansion of the Americas team and network. Rich has extensive technical and commercial experience having worked in the electronics industry since 1977 in a wide variety of senior international sales, marketing and operations roles.

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Simultaneous bottom and top inline inspection

PowerSpector BTL - Bottom & top inline AOI

PowerSpector BTL Bottom & Top In Line Automatic Optical Inspection Systems

PowerSpector BTL - bottom -top inline AOIThe fastest inspection of PCBs after Reflow, Wave or Selective soldering & placement of SMT & THT components.

  • Patented lighting synchronization allows both heads to inspect at the same time.
  • Eradicate the need for flip stations – remove potential for stress on assemblies and improve long term reliability of solder joints.
  • Reliably detect solder and components related defects from both sides using up to 18 cameras.

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Jeroen Nagtzaam joins as new Operations & Logistics Manager

Jeroen Nagtzaam, Mek operations & logistics managerJeroen Nagtzaam has recently joined us in the position of Operations & Logistics to help with continued company growth.  As part of the Mek team, based at the Mek Europe Tilburg headquarters, Jeroen will oversee the smooth delivery and logistics of Mek AOI and SPI systems and take a supportive role in sales activities and fulfilment. Continue reading

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What are the major challenges today in inspection in the electronics manufacturing industry?

Mek THT AOIThe major challenge for AOI in today’s industry is one of protocol, improved track and trace and data logging for all the products coming in/ going out, including products which to date have rarely been inspected, like those still using THT components.

Pressure for increased inspection and traceability information comes from OEMs, wanting to protect their brand. AOI of course helps to reduce faults creeping through on the production line and traceability helps to facilitate product recalls should any issues arise. Continue reading

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6 sigma 3D inspection at Productronica and Apex

Mek at ProductronicaThe team from Marantz Electronics (Mek) enjoyed a very successful Productronica exhibition in Munich, Germany this year.
44,000 visitors from 85 countries came to Munich, an increase of almost 20% over the previous event and the Marantz stand was overwhelmed by the positive feedback from visitors and distributors, all impressed by the company’s new AOI technologies.
Productronica represented the European launch of Mek’s new flagship 3D AOI system ISO-Spector M1A, which will subsequently be rolled out across the rest of the world in 2018. Continue reading

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3D Measurement & 3D AOI

ISO-Spector 3D AOI

Mek ISO-Spector series delivers a genuine, FULL 3D inspection

3D measurement is the latest development trend in assembled PCB inspection. It’s creating quite a stir and it does indeed offer many advantages in terms of improved accuracy & stability of inspection results. Having quantitative data gives much tighter control than “classic” AOI and is a big step forward in improving the quality assurance and process control of assembled PCBs.

Unfortunately, the term ‘Full 3D’ is often used inaccurately. Full 3D implies that the height profile across the whole PCB is being measured, but most of the time, the majority of systems can only measure height selectively, and only on component bodies, NOT the solder joints. And even then, only the components that the programmer has specifically identified and selected for height measurement. For the remainder, classic 2D algorithms and lights are used for the inspection. Continue reading

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