Mek Inline AOI systems can be easily positioned to fully integrate with your assembly line.
A valuable part of your workflow process, Mek inline AOI systems will directly identify errors and emerging process trends. Refining even the most complex process, they deliver optimal productivity for every electronics manufacturing environment.
Mek PowerSpector inline AOI systems, featuring the new G series inspection head, are designed for maximum defect coverage whilst maintaining short programming times. They can be equipped with 9 cameras: 1 top and 8 side cameras.
Powered by GTAz inspection engine for quality inspection of solder joints
The PowerSpector GTAz, X2 faster than the previous generation of inspection head, is designed for customers for whom production quality is priority.
GTAz is the most versatile of the Mek inspection engines, reliably inspecting SMT and THT component bodies for presence/absence, type, polarity, offset, text, colours etc. and components solder fillets for excessive solder, insufficient solder, no solder, shorts, lifted leads etc. Suitable for use in pre reflow, post reflow, post wave and post selective soldering, it can also be used for 2D solder paste inspection and first article inspection.
With a revolutionary Passive 3D capture technique utilizing the side cameras, 3D component images are created using all 9 cameras. The addition of a new White side light allows for real sides images of these 3D components..
With its high resolution top camera with telecentric lens and new unique multiplexed 8x USB 3 Vision side camera technology with shift tilt lenses in 45/45 orientation, defects become visible as never before. For the top camera there is a choice between 10µ and 18.75µ per pixel lenses depending on the smallest component placed on the assembled PCB’s.
The 4 light sources with 2 different colours and from different angles create a detailed profile of solder menisci while the white main light results in real colour representation of components. With the DOAL (Diffused On Axis Light) that projects exactly 90⁰ on the target components, solder quality can always be inspected even when tall components are present.
The Z axis allows for compensation of warp and the ability to focus in on the tops of tall components and Sub PCBs mounted above the normal plain of the PCB
For maximum flexibility, the optical unit is configurable to fit your needs today while providing upgrade possibilities for the future. The XY drive gantry with ball screw mechanics allows high speed inspection while maintaining high accuracy and precision. Specially coated shafts deliver quiet operation and minimal wear for lowest maintenance and calibration requirements. Automatic conveyor width adjustment is included for convenient product changeover and a PCB support lift for reliable inspection of warped PCB’s.
All PowerSpector inline AOI systems are available in M, XXL and XXXL (350x250mm, 650x550mm and 800x550mm) size versions.
For bottom and top simultaneous inspection, the PowerSpector BTL delivers the fastest inspection times in the industry.